ES434-15 ASICS, MEMS and Smart Devices
The course aims to present, mainly though substantial practical experience, the design methodology of Application Specific Integrated Circuits (ASICs) and Micro-Electro-Mechanical Systems (MEMS).
This is an indicative module outline only to give an indication of the sort of topics that may be covered. Actual sessions held may differ.
Devices and silicon processing; ASIC (based on analogue/digital VLSI) and MEMS design; silicon micromachining and other emerging process technologies; system design methodology; device design styles: detailed optimisation (cost and power), principles and applications. Examples will include physical and chemical microsensors, MEMS and microsystems. Automotive, environmental, industrial and healthcare applications. Students are expected to solve problems taken from the recommended text-book.
Written Design Project: ASIC chip, MEMS or smart device to be designed and simulated in laboratories with students working individually.
By the end of the module, students should be able to:
- Critique the main principles of ASICs, smart systems and devices.
- Design ASICS and MEMS through practical experience using typical modern Computer Aided Design software for this task.
- Understand emerging techniques in ASICs, MEMS and smart sensor systems.
- Evaluate the principles and processes involved in the implementation of complex VLSI circuits and MEMS devices.
Indicative reading list
A "Microsensors, MEMS and Smart Devices", Gardner, J.W., 2001, 9780471861096, TK 7874.G2
B "CMOS Analog Circuit Design", Allen, P.E. , 2012, 978-0199765072,
B "CMOS VLSI design", Weste, N.H.E, 2011, 9780321547743, TK 7872.468.W3
B "Integrated Circuit Design", Weste, N.H.E, 2011, 978-0321696946,
C "MEMS Mechanical Sensors", Beeby, S, 2004, 9781580535366, TK 7874.M3
Subject specific skills
- Ability to conceive, design and model a CMOS or MEMS component, product, and process
- Ability to develop economically viable solutions to ASIC and MEMS components.
- Ability to seek to achieve ASIC solutions to potential applications and have strategies for being creative and innovative.
- Ability to be performance, cost and value-conscious CMOS design, and aware of their environmental, health and safety, and wider professional engineering responsibilities.
- Awareness of the nature of business and enterprise in the creation of economic and social value.
- Overcome difficulties by employing skills, knowledge and understanding in a flexible manner.
- Ability to formulate and operate within appropriate codes of conduct, when faced with an engineering issue.
- Appreciation of the international dimensions of engineering, commerce and communication.
|Lectures||20 sessions of 1 hour (13%)|
|Practical classes||5 sessions of 3 hours (10%)|
|Other activity||1 hour (1%)|
|Private study||114 hours (76%)|
Private study description
Self-study of 114 hours
Other activity description
1x1 hour Revision Class
No further costs have been identified for this module.
You must pass all assessment components to pass the module.
Students can register for this module without taking any assessment.
Assessment group A4
|A1 Exercise Sheet||20%|
Up to 6 pages in length
|Computer-based Design & Simulation Report||30%|
Up to 6 pages in length
Up to 10 pages in length
Feedback on assessment
Feedback during all 5 laboratory sessions of progress.
Feedback on Exercise Sheet.
Feedback from laboratory-based design report.
Cohort level feedback on examinations.
This module is Core for:
UESA-H635 MEng Electronic Engineering
- Year 4 of H635 Electronic Engineering
- Year 4 of H60C Electronic Engineering with Business Management
- Year 4 of H60D Electronic Engineering with Communications
- Year 4 of H60G Electronic Engineering with Robotics
- Year 4 of H60F Electronic Engineering with Systems Engineering
- Year 4 of UESA-H63X MEng Electronic Engineering
- Year 4 of UESA-H64Z MEng Electronic Engineering with Exchange Year
- Year 5 of UESA-H636 MEng Electronic Engineering with Intercalated Year
- Year 5 of UESA-H63Y MEng Electronic Engineering with Intercalated Year
- Year 4 of UESA-H606 Undergraduate Electrical and Electronic Engineering MEng
This module is Optional for:
- Year 4 of UESA-H117 MEng Engineering with Exchange Year
RESA-H6P9 Postgraduate Research Wide Bandgap Power Electronics
- Year 1 of H6P9 Wide Bandgap Power Electronics (EngD)
- Year 2 of H6P9 Wide Bandgap Power Electronics (EngD)
- Year 1 of TESA-H641 Postgraduate Taught Communications and Information Engineering
- Year 1 of TESA-H642 Postgraduate Taught Energy and Power Engineering
This module is Option list A for:
- Year 4 of UESA-H635 MEng Electronic Engineering
UESA-H107 MEng Engineering
- Year 4 of H107 Engineering MEng
- Year 4 of H10E Engineering with Appropriate Technology MEng
- Year 4 of H10J Engineering with Automotive Engineering MEng
- Year 4 of H10C Engineering with Business Management MEng
- Year 4 of H10G Engineering with Communications MEng
- Year 4 of H10H Engineering with Computer Engineering MEng
- Year 4 of H10M Engineering with Fluid Dynamics MEng
- Year 4 of H10F Engineering with Instrumentation MEng
- Year 4 of H10K Engineering with Robotics MEng
- Year 4 of H10D Engineering with Sustainability MEng
- Year 4 of H10L Engineering with Systems Engineering MEng
- Year 4 of UESA-H114 MEng Engineering
- Year 5 of UESA-H109 MEng Engineering with Intercalated Year
- Year 4 of UESA-H311 MEng Mechanical Engineering
UESA-HH63 MEng Systems Engineering
- Year 4 of H63C Systems Engineering with Computer Engineering
- Year 4 of H63D Systems Engineering with Instrumentation
- Year 4 of UCSA-G408 Undergraduate Computer Systems Engineering